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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 TDS-EN.pdf
9504 One-Component Pre-Curing Type Thermal Gel, which has no residual stress after sizing, effectively protects precision electronic components from damage
Product Description
Pink paste gel
One-part pre-curing type
Silicone thermal conductivity complex
Product Features:
High thermal conductivity 4W/m∙K
Very small BLT and very low thermal resistance
Soft adhesion and self-adhesive properties after dispensing
Excellent chemical and mechanical stability
No residual stress after sizing, effectively protects precision electronic components from damage
Technical Parameters
Reference standard
Item
Unit
Value
GB/T 13354
Density
g/cm 3
3.2
--
Extrusion rate
(30ccEFD@90psi)
g/min
30
ISO22007
Thermal conductivity
W/ m·K
4.0
GB/T2408
Flame retardant
/
V0
GB/T2408
Volume resistivity
Ω·cm
≥1.0×10 13
ASTM D149
Dielectric strength
Kv/ mm
8.0
ASTM D5470
Minimum thickness
mm
0.1
Main Applications:
Bare die chip low-stress mounting
Heat dissipation field of 5G communication boards
Automotive electronic equipment
Smart phone modules and consumer-electronics
Other high-value boards need to be reworked
Packing:
30cc/tube; 300cc/tube
Storage:
Store below 35°C in a cool and dry place.
Shelf life is 6 months.
9506 One Component Pre Curing Type Thermal Gel Pre Curing System For Easy Dispensing
9506 TDS-EN.pdf
9506 One-Component Pre-Curing Type Thermal Ge l, which has excellent chemical and mechanical stability.
Product Description
One-part silicone thermal conductive gel
Blue paste
Pre-curing type
Product Features:
Thermal conductivity: 6.0 W/ m·K
Pre-curing system for easy dispensing
Excellent chemical and mechanical stability
No residual stress after gluing, effectively protects precision electronic components from damage
Technical Parameters
Reference standard
Item
Unit
Value
ASTM D792
Density
g/cm 3
3.3±0.3
Huitian test method
Flow velocity
(30cc EFD/ 90psi/60s)
g/min
30
ASTM D257
Volume resistivity
Ω·cm
1.0×10 12
ASTM D149
Dielectric strength
Kv/mm
4
ISO22007
Thermal conductivity
W/ m·K
6.0±10%
Operating temperature
℃
-40~150
Main Applications:
Bare die chip low-stress mounting environment
5G communication board cooling field
High-value boards need to be reworked
Smart phone modules and consumer electronics etc
Packing:
30cc/tube; 300cc/cartridge
Storage:
Store at 8-25°C in a cool and dry place.
Shelf life is 6 months.
5272 Two Component Thermal Gel Gap Filler Working Temperature Range -40℃~200℃ Excellent Insulation Performance
5272 TDS-EN.pdf
5272 is a two-component room-temperature curing silicone gel, that has high thermal conductivity and low density, good weather resistance, and aging resistance.
Product Description
Two-component room-temperature curing silicone gel
1:1 heat curing
Product Features:
High thermal conductivity
Excellent insulation properties
Good weather and aging resistance
Flame retardant grade: up to UL94V-0
Working temperature: -40°C~200°C
RoHS Directive
Technical Parameters
Reference standard
Item
Unit
Value
Properties before curing (25±2 ℃ , 60±5%RH)
Q/HTXC 2
Appearance (A)
--
White paste
Appearance (B)
--
Blue paste
GB/T 2794
Viscosity (A)
Pa·s
80-160
Viscosity (B)
Pa·s
80-160
GB/T13354
Density (A)
g/cm 3
2.8±0.1
Density (B)
g/cm 3
2.8±0.1
Curing properties ( A:B=1:1 )
Q/HTXC 2
Curing time (80℃)
min
30
Q/HTXC 2
Initial curing time (25℃)
min
240
Properties after curing (25±2 ℃ , 60±5%RH)
GB/T531
Hardness
Shore 00
40~60
ASTM D149
Dielectric strength
KV/mm
7
ASTM D150
Dielectric constant
/
5
ISO 22007
Thermal conductivity
W/m·K
2.5±10%
US EPA8270E
D3-D10
Ppm
<1,000
Main Applications:
New energy vehicle lithium battery
Automobile electronic equipment
Large storage devices
Communication equipment board
Packing:
350ml/cartridge; 25kg/barrel
Storage:
Store at 8-25°C in a cool and dry place.
Shelf life is 6 months.
5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature
5274 TDS-EN.pdf
5274 i s a two-component silicone thermal conductive ge l, which be able to cure at room temperature or accelerate curing at high temperature
Product Description
Silicone thermal conductive composite
Blue/white gel
1:1 mixture of two components
Product Features:
Thermal conductivity: 4.0 W/m∙K
Excellent workability
Curing at room temperature or accelerated curing at high temperature
Low static/transient stress on substrates
High reliability under various conditions
Technical Parameters
Standards
Items
Unit
Values
Visual
Appearance (A/B)
-
Blue/white
ASTM D792
Density (A/B)
g/ml
3.2/3.2
/
Mix ratio
-
1 :1 (W/W)
ASTM D2196
Viscosity
Pa·s
250 ±100
ASTM D5470
Thermal conductivity
W/(m·K)
4.0
ASTM D5470
Thermal Impedance
℃·cm2 /W
0.43
ASTM D257
Volume resistivity
Ω·cm
1.0×10 12
ASTM D149
Dielectric strength
KV/m
15
UL94
Flame rating
-
V-0
∕
Operating temperature
℃
-40-200
∕
Operating time @ 25℃
min
>60
/
Cure time @ 25℃
h
8
∕
Cure time@120℃
min
20
Main Applications:
Heat dissipation of lithium battery packs in new energy vehicles
Heat dissipation of battery packs in energy storage power stations
Automotive electronic equipment
Large storage devices
Communication equipment
Packing:
400ml/cartridge; 25kg/barrel; 298kg/drum
Storage:
Store at 8-25°C in a cool and dry place.
Shelf life is 6 months.
5270 Two Component Thermal Gel Gap Filler Low Viscosity And Good Workability Able To Cure At Room Temperature
5270 TDS-EN.pdf
5270 i s a two-component silicone thermal conductive gel, which has h igh thermal conductivity and low density
Product Description
Silicone thermal conductive two-component gel
Low transient/static stress
Two-part 1: 1 mix
Product Features:
Thermal conductivity: 2.0 W/m∙K
Can be cured at room temperature or accelerated at high temperature
Low viscosity and good operability
High reliability under various aging conditions
Technical Parameters
Standards
Items
Unit
Values
Visual
Appearance (A/B)
-
White/Green
ASTM D792
Density (A/B)
g/ml
2.1/2.1
/
Mix ratio
-
1 :1 (W/W)
ASTM D2196
Viscosity
mPa·s
250,000
ASTM D5470
Thermal conductivity
W/(m·K)
2.0
ASTM D2240
Hardness after curing
Shore00
50
ASTM D257
Volume resistivity
Ω·cm
1.0×10 1 2
ASTM D149
Dielectric strength
KV/m
12
UL94
Flame rating
-
V-0
∕
Operating temperature
℃
-40-150
∕
Operating time @ 25℃
min
120
/
Cure time
@ 25℃
h
24
∕
Cure time @120℃
min
20
Main Applications:
New energy vehicle lithium battery
Automobile electronic equipment
Large storage devices
Communication equipment board
Packing:
30cc/tube; 400cc/cartridge
Storage:
Store at 8-25°C in a cool and dry place.
Shelf life is 6 months.
9503 One-Component Pre-Curing Type Thermal Gel High Power LED And Other Applications Requiring Heat Dissipation
9503 TDS-EN.pdf
9503 One-Component Pre-Curing Type Thermal Gel, which has h igh thermal conductivity and high thixotropy.
Product Description
Blue Cement
Pre-curing type
Self-adhesive
Product Features:
High thermal conductivity, high thixotropy
Excellent weather and aging resistance
Working temperature -40-150℃
RoHS Directive
Technical Parameters
Reference standard
Item
Unit
Value
GB/T 13354
Density
g/cm 3
2.0-2.2
Q/HTXC 1
Flow velocity
g/min
20-40
ISO22007
Thermal conductivity
W/ m·K
2.0±10%
GB/T2408
Flame retardant
/
V0
GB/T2408
Volume resistivity
Ω·cm
≥1.0×10 12
ASTM D149
Dielectric strength
Kv/ mm
≥5
ASTM D5470
Minimum thickness
mm
0.12
Main Applications:
Heat dissipation in new energy vehicle cells and modules; electronic components, flip-chips, transformers, high-power LEDs, and other applications with similar heat dissipation needs
Packing:
650g/tube
Storage:
Store below 35°C in a cool and dry place.
Shelf life is 6 months.
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 TDS-EN.pdf
9504 One-Component Pre-Curing Type Thermal Gel, which has no residual stress after sizing, effectively protects precision electronic components from damage
Product Description
Pink paste gel
One-part pre-curing type
Silicone thermal conductivity complex
Product Features:
High thermal conductivity 4W/m∙K
Very small BLT and very low thermal resistance
Soft adhesion and self-adhesive properties after dispensing
Excellent chemical and mechanical stability
No residual stress after sizing, effectively protects precision electronic components from damage
Technical Parameters
Reference standard
Item
Unit
Value
GB/T 13354
Density
g/cm 3
3.2
--
Extrusion rate
(30ccEFD@90psi)
g/min
30
ISO22007
Thermal conductivity
W/ m·K
4.0
GB/T2408
Flame retardant
/
V0
GB/T2408
Volume resistivity
Ω·cm
≥1.0×10 13
ASTM D149
Dielectric strength
Kv/ mm
8.0
ASTM D5470
Minimum thickness
mm
0.1
Main Applications:
Bare die chip low-stress mounting
Heat dissipation field of 5G communication boards
Automotive electronic equipment
Smart phone modules and consumer-electronics
Other high-value boards need to be reworked
Packing:
30cc/tube; 300cc/tube
Storage:
Store below 35°C in a cool and dry place.
Shelf life is 6 months.
9506 One Component Pre Curing Type Thermal Gel Pre Curing System For Easy Dispensing
9506 TDS-EN.pdf
9506 One-Component Pre-Curing Type Thermal Ge l, which has excellent chemical and mechanical stability.
Product Description
One-part silicone thermal conductive gel
Blue paste
Pre-curing type
Product Features:
Thermal conductivity: 6.0 W/ m·K
Pre-curing system for easy dispensing
Excellent chemical and mechanical stability
No residual stress after gluing, effectively protects precision electronic components from damage
Technical Parameters
Reference standard
Item
Unit
Value
ASTM D792
Density
g/cm 3
3.3±0.3
Huitian test method
Flow velocity
(30cc EFD/ 90psi/60s)
g/min
30
ASTM D257
Volume resistivity
Ω·cm
1.0×10 12
ASTM D149
Dielectric strength
Kv/mm
4
ISO22007
Thermal conductivity
W/ m·K
6.0±10%
Operating temperature
℃
-40~150
Main Applications:
Bare die chip low-stress mounting environment
5G communication board cooling field
High-value boards need to be reworked
Smart phone modules and consumer electronics etc
Packing:
30cc/tube; 300cc/cartridge
Storage:
Store at 8-25°C in a cool and dry place.
Shelf life is 6 months.
5272 Two Component Thermal Gel Gap Filler Working Temperature Range -40℃~200℃ Excellent Insulation Performance
5272 TDS-EN.pdf
5272 is a two-component room-temperature curing silicone gel, that has high thermal conductivity and low density, good weather resistance, and aging resistance.
Product Description
Two-component room-temperature curing silicone gel
1:1 heat curing
Product Features:
High thermal conductivity
Excellent insulation properties
Good weather and aging resistance
Flame retardant grade: up to UL94V-0
Working temperature: -40°C~200°C
RoHS Directive
Technical Parameters
Reference standard
Item
Unit
Value
Properties before curing (25±2 ℃ , 60±5%RH)
Q/HTXC 2
Appearance (A)
--
White paste
Appearance (B)
--
Blue paste
GB/T 2794
Viscosity (A)
Pa·s
80-160
Viscosity (B)
Pa·s
80-160
GB/T13354
Density (A)
g/cm 3
2.8±0.1
Density (B)
g/cm 3
2.8±0.1
Curing properties ( A:B=1:1 )
Q/HTXC 2
Curing time (80℃)
min
30
Q/HTXC 2
Initial curing time (25℃)
min
240
Properties after curing (25±2 ℃ , 60±5%RH)
GB/T531
Hardness
Shore 00
40~60
ASTM D149
Dielectric strength
KV/mm
7
ASTM D150
Dielectric constant
/
5
ISO 22007
Thermal conductivity
W/m·K
2.5±10%
US EPA8270E
D3-D10
Ppm
<1,000
Main Applications:
New energy vehicle lithium battery
Automobile electronic equipment
Large storage devices
Communication equipment board
Packing:
350ml/cartridge; 25kg/barrel
Storage:
Store at 8-25°C in a cool and dry place.
Shelf life is 6 months.
5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature
5274 TDS-EN.pdf
5274 i s a two-component silicone thermal conductive ge l, which be able to cure at room temperature or accelerate curing at high temperature
Product Description
Silicone thermal conductive composite
Blue/white gel
1:1 mixture of two components
Product Features:
Thermal conductivity: 4.0 W/m∙K
Excellent workability
Curing at room temperature or accelerated curing at high temperature
Low static/transient stress on substrates
High reliability under various conditions
Technical Parameters
Standards
Items
Unit
Values
Visual
Appearance (A/B)
-
Blue/white
ASTM D792
Density (A/B)
g/ml
3.2/3.2
/
Mix ratio
-
1 :1 (W/W)
ASTM D2196
Viscosity
Pa·s
250 ±100
ASTM D5470
Thermal conductivity
W/(m·K)
4.0
ASTM D5470
Thermal Impedance
℃·cm2 /W
0.43
ASTM D257
Volume resistivity
Ω·cm
1.0×10 12
ASTM D149
Dielectric strength
KV/m
15
UL94
Flame rating
-
V-0
∕
Operating temperature
℃
-40-200
∕
Operating time @ 25℃
min
>60
/
Cure time @ 25℃
h
8
∕
Cure time@120℃
min
20
Main Applications:
Heat dissipation of lithium battery packs in new energy vehicles
Heat dissipation of battery packs in energy storage power stations
Automotive electronic equipment
Large storage devices
Communication equipment
Packing:
400ml/cartridge; 25kg/barrel; 298kg/drum
Storage:
Store at 8-25°C in a cool and dry place.
Shelf life is 6 months.
5270 Two Component Thermal Gel Gap Filler Low Viscosity And Good Workability Able To Cure At Room Temperature
5270 TDS-EN.pdf
5270 i s a two-component silicone thermal conductive gel, which has h igh thermal conductivity and low density
Product Description
Silicone thermal conductive two-component gel
Low transient/static stress
Two-part 1: 1 mix
Product Features:
Thermal conductivity: 2.0 W/m∙K
Can be cured at room temperature or accelerated at high temperature
Low viscosity and good operability
High reliability under various aging conditions
Technical Parameters
Standards
Items
Unit
Values
Visual
Appearance (A/B)
-
White/Green
ASTM D792
Density (A/B)
g/ml
2.1/2.1
/
Mix ratio
-
1 :1 (W/W)
ASTM D2196
Viscosity
mPa·s
250,000
ASTM D5470
Thermal conductivity
W/(m·K)
2.0
ASTM D2240
Hardness after curing
Shore00
50
ASTM D257
Volume resistivity
Ω·cm
1.0×10 1 2
ASTM D149
Dielectric strength
KV/m
12
UL94
Flame rating
-
V-0
∕
Operating temperature
℃
-40-150
∕
Operating time @ 25℃
min
120
/
Cure time
@ 25℃
h
24
∕
Cure time @120℃
min
20
Main Applications:
New energy vehicle lithium battery
Automobile electronic equipment
Large storage devices
Communication equipment board
Packing:
30cc/tube; 400cc/cartridge
Storage:
Store at 8-25°C in a cool and dry place.
Shelf life is 6 months.